Methods, apparatuses, and systems for diagnosing misalignment in gas detecting devices

ABSTRACT

Methods, apparatuses, and systems for diagnosing misalignment in gas detecting devices are provided. An example method may include causing at least one detector component of a receiver element of the open path gas detecting device to generate a first light intensity indication corresponding to first infrared light; causing the at least one detector component to generate a second light intensity indication corresponding to second infrared light; and generating an alignment indication based at least in part on the first light intensity indication and the second light intensity indication.

BACKGROUND

A gas detecting device (or a gas detector) refers to an apparatus thatmay detect, measure, and/or identify one or more gaseous substances inan environment. For example, a gas detecting device may detect aconcentration level of a gaseous substance (also referred to as “targetgaseous substance”) in an area. A gas detecting device may be part of asafety system. When the concentration level of hazardous or harmfulgaseous substance detected by the gas detecting device exceeds athreshold, the safety system may generate a notification (for example,an alarm) to operator(s) of the safety system, so that the operator(s)may carry out one or more remedial actions (for example, shutting downthe source of the gaseous substance, leaving the area, etc.).

BRIEF SUMMARY

In accordance with various examples of the present disclosure, anexample gas detecting device may be provided. In some examples, theexample gas detecting device may comprise a transmitter element, areceiver element, and a microcontroller.

In some examples, the transmitter element may comprise an infrared lightsource component configured to generate infrared light. In someexamples, the receiver element may comprise at least one detectorcomponent configured to generate a light intensity indicationcorresponding to the infrared light. In some examples, themicrocontroller may be electronically coupled to the transmitter elementand the receiver element.

In some examples, the microcontroller may be configured to generate analignment indication based at least in part on a first light intensityindication corresponding to first infrared light and a second lightintensity indication corresponding to second infrared light. In someexamples, the alignment indication may indicate whether the transmitterelement is misaligned.

In some examples, the microcontroller may be configured to: cause theinfrared light source component to generate the first infrared lighttriggered at a first discharge energy level; cause the at least onedetector component to generate the first light intensity indicationcorresponding to the first infrared light; cause the infrared lightsource component to generate the second infrared light triggered at asecond discharge energy level; and cause the at least one detectorcomponent to generate the second light intensity indicationcorresponding to the second infrared light.

In some examples, the transmitter element may comprise a power sourcecomponent electronically coupled to the infrared light source component.In some examples, when causing the infrared light source component togenerate the first infrared light, the microcontroller may be configuredto cause the power source component to supply a first voltage levelpower to the infrared light source component. In some examples, whencausing the infrared light source component to generate the secondinfrared light, the microcontroller may be configured to cause the powersource component to supply a second voltage level power to the infraredlight source component.

In some examples, the first light intensity indication may indicate afirst intensity level of the first infrared light received by thereceiver element. In some examples, the second light intensityindication may indicate a second intensity level of the second infraredlight received by the receiver element.

In some examples, the microcontroller may be further configured to:calculate a ratio value based on the first light intensity indicationand the second light intensity indication; and determine whether theratio value satisfies a predetermined threshold.

In some examples, the microcontroller may be further configured to: inresponse to determining that the ratio value satisfies the predeterminedthreshold, generate the alignment indication to indicate that thetransmitter element is not misaligned to the receiver element.

In some examples, the microcontroller may be further configured to: inresponse to determining that the ratio value does not satisfy thepredetermined threshold, generate the alignment indication to indicatethat the transmitter element is misaligned to the receiver element.

In accordance with various examples of the present disclosure, anexample method for diagnosing misalignment of a transmitter element ofan open path gas detecting device may be provided. In some examples, theexample method may comprise: causing at least one detector component ofa receiver element of the open path gas detecting device to generate afirst light intensity indication corresponding to first infrared light;causing the at least one detector component to generate a second lightintensity indication corresponding to second infrared light; andgenerating an alignment indication based at least in part on the firstlight intensity indication and the second light intensity indication.

In accordance with various examples of the present disclosure, a gasdetecting device is provided. The gas detecting device may comprise areceiver element and a microcontroller electronically coupled to thereceiver element.

In some examples, the receiver element may comprise a detection channeland a diagnosis channel. In some examples, each of the detection channeland the diagnosis channel may be configured to generate a lightintensity indication corresponding to infrared light received by thereceiver element. In some examples, the detection channel may be in aparallel arrangement with the diagnosis channel. In some examples, aneffective field of view of the diagnosis channel may be smaller than theeffective field of view of the detection channel.

In some examples, the microcontroller may be configured to: generate analignment indication based at least in part on a first light intensityindication generated by the detection channel and a second lightintensity indication generated by the diagnosis channel. In someexamples, the alignment indication may indicate whether the receiverelement is misaligned.

In some examples, the microcontroller may further be configured to:calculate a ratio value based on the first light intensity indicationand the second light intensity indication; and determine whether theratio value satisfies a predetermined threshold.

In some examples, the microcontroller may be further configured to: inresponse to determining that the ratio value satisfies the predeterminedthreshold, generate the alignment indication to indicate that thereceiver element is not misaligned to the transmitter element.

In some examples, the microcontroller may be further configured to: inresponse to determining that the ratio value does not satisfy thepredetermined threshold, generate the alignment indication to indicatethat the receiver element is misaligned to the transmitter element.

In accordance with various examples of the present disclosure, anexample method for diagnosing misalignment of a receiver element of anopen path gas detecting device may be provided. In some examples, theexample method may comprise causing the detection channel to generate afirst light intensity indication corresponding to the infrared light;causing the diagnosis channel to generate a second light intensityindication corresponding to the infrared light; and generating analignment indication based at least in part on the first light intensityindication and the second light intensity indication. In some examples,the alignment indication may indicate whether the receiver element ismisaligned.

The foregoing illustrative summary, as well as other exemplaryobjectives and/or advantages of the disclosure, and the manner in whichthe same are accomplished, are further explained in the followingdetailed description and its accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The description of the illustrative examples may be read in conjunctionwith the accompanying figures. It will be appreciated that, forsimplicity and clarity of illustration, components and elementsillustrated in the figures have not necessarily been drawn to scale,unless described otherwise. For example, the dimensions of some of thecomponents or elements may be exaggerated relative to other elements,unless described otherwise. Examples incorporating teachings of thepresent disclosure are shown and described with respect to the figurespresented herein, in which:

FIG. 1A illustrates an example view of an example open path gasdetecting device in accordance with various examples of the presentdisclosure;

FIG. 1B and FIG. 1C illustrate example views of an example transmitterelement in accordance with various examples of the present disclosure;

FIG. 1D and FIG. 1E illustrate example views of an example receiverelement in accordance with various examples of the present disclosure;

FIG. 2 illustrates an example diagram for an example transmitter elementin accordance with various examples of the present disclosure;

FIG. 3 illustrates an example flowchart for an example method fordiagnosing misalignment of an example transmitter element in accordancewith various examples of the present disclosure;

FIG. 4 , FIG. 5 , FIG. 6 , and FIG. 7 illustrate example diagramsshowing example irradiance levels in accordance with various examples ofthe present disclosure;

FIG. 8 illustrates an example diagram of an example receiver element inaccordance with various examples of the present disclosure; and

FIG. 9 illustrates an example flowchart for an example method fordiagnosing misalignment of an example receiver element in accordancewith various examples of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

Some examples of the present disclosure will now be described more fullyhereinafter with reference to the accompanying drawings, in which some,but not all examples of the disclosure are shown. Indeed, thesedisclosures may be embodied in many different forms and should not beconstrued as limited to the examples set forth herein; rather, theseexamples are provided so that this disclosure will satisfy applicablelegal requirements. Like numbers refer to like elements throughout.

The phrases “in one example,” “according to one example,” “in someexamples,” and the like generally mean that the particular feature,structure, or characteristic following the phrase may be included in atleast one example of the present disclosure and may be included in morethan one example of the present disclosure (importantly, such phrases donot necessarily refer to the same example).

If the specification states a component or feature “may,” “can,”“could,” “should,” “would,” “preferably,” “possibly,” “typically,”“optionally,” “for example,” “as an example,” “in some examples,”“often,” or “might” (or other such language) be included or have acharacteristic, that specific component or feature is not required to beincluded or to have the characteristic. Such component or feature may beoptionally included in some examples, or it may be excluded.

The word “example” or “exemplary” is used herein to mean “serving as anexample, instance, or illustration.” Any implementation described hereinas “exemplary” is not necessarily to be construed as preferred oradvantageous over other implementations.

The term “electronically coupled,” “electronically coupling,”“electronically couple,” “in communication with,” “in electroniccommunication with,” or “connected” in the present disclosure refers totwo or more elements or components being connected through wired meansand/or wireless means, such that signals, electrical voltage/current,data and/or information may be transmitted to and/or received from theseelements or components.

In some examples, existing gas detecting devices are plagued bychallenges and limitations. For example, many gas detecting devices donot have the capability to identify and/or diagnose misalignment ofvarious components of the gas detecting device. When misalignmentoccurs, the performance of these gas detecting devices may be impacted.

One example of a gas detecting device is as an “open path gas detectingdevice,” which refers to a type of gas detectors that may be configuredto detect, measure, and/or identify a concentration level of one or moregaseous substances (“target gaseous substance) in an area and/or along apath. In some examples, the open path gas detecting device may be basedon a spectroscopic sensor such as a nondispersive infrared (NDIR)sensor. For example, an example open path gas detecting device maycomprise at least two elements: a transmitter element and a receiverelement. The transmitter element may be positioned at a distance fromthe receiver element, forming an optical path between the transmitterelement and the receiver element.

The transmitter element may be configured to emit infrared light (alsoreferred to as infrared radiation herein). The infrared light may travelalong the optical path between the transmitter element and the receiverelement, and gaseous substance along the optical path may absorb atleast some of infrared light. The infrared light may ultimately bereceived and detected by the receiver element. The receiver element maycomprise at least one detector component, which may detect, measure,and/or identify the intensity level of the infrared light that hastravelled through the gaseous substance along the optical path andreceived by the receiver element. For example, the at least one detectorcomponent may comprise a sensor that may comprise a photodiode activearea to detect, measure, and/or identify intensity level of the infraredlight. Additionally, or alternatively, other suitable sensor(s) may beimplemented to detect, measure, and/or identify the intensity level ofthe infrared light or the infrared radiation.

Based on the intensity level of the infrared light as detected byreceiver element, the open path gas detecting device may calculate thelevel of infrared light that has been absorbed by the gaseous substancealong the optical path, and therefore may, in some examples, determinethe concentration level of the gaseous substance. Additional details ofthe open path gas detecting device, the transmitter element, and thereceiver element are described further herein.

As shown in the above example, an accurate alignment of both thetransmitter element and the receiver element may be important tooperations of the open path gas detecting device. For example, an openpath gas detecting device may rely upon the correct alignment to deliverrobust and error-free operation in adverse environmental conditions (forexample, severe weather conditions such as snowing, raining, dense fogcondition). Errors in the alignment of the transmitter element and/orthe receiver element may impact the performance of an open path gasdetecting device in a number of ways.

For example, a misalignment between the transmitter element and thereceiver element may reduce the light throughput of the open path gasdetecting device, therefore limiting the capability for the open pathgas detecting device to detect, measure, and/or identify gaseoussubstance in adverse environmental conditions such as a dense fogcondition. As another example, a misalignment may increase sensitivityof the open path gas detecting device to partial obscuration, which mayresult in the open path gas detecting device producing erroneousreadings of concentration level of the target gaseous substance. Asanother example, a misalignment may cause increased sensitivity of theopen path gas detecting device to vibration. As another example, amisalignment may reduce the capability of the open path gas detectingdevice to adjust to changes in alignment that may occur as a consequenceof installation conditions. For example, the transmitter element and thereceiver element may be installed on two different locations, and therelative position between these two difference locations may changeduring the course of operation.

Examples of the present disclosure may overcome many challenges andlimitations associated with gas detecting devices. For example, examplesof the present disclosure may provide an effective means of detectingerrors in alignment of the transmitter element and/or the receiverelement that may occur, for example, during operation of the open pathgas detecting device. Examples of the present disclosure may signalthose errors to an operator, and enable the operator to take appropriateaction to realign the transmitter element and/or the receiver elementprior to the open path gas detecting device exhibiting a degradation inperformance.

Referring now to FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, and FIG. 1E,example views of example components of an example open path gasdetecting device are illustrated. In the example shown in FIG. 1A, theexample open path gas detecting device may comprise a transmitterelement 101 and a receiver element 103.

In some examples, the transmitter element 101 may be configured toproduce, generate, emit, and/or trigger the production, generation,and/or emission of infrared light. For example, the transmitter element101 may comprise an infrared light source component that may produce,generate, and/or emit infrared light. Example infrared light sourcecomponents may include, but are not limited to, gas discharge lamps,fluorescent lamps, heat lamps, and/or the like. The term “gas dischargelamp” refers to a type of artificial light source that may generatelight by sending an energy discharge (such as electric discharge)through an ionized gas. As an example, the infrared light sourcecomponent of the transmitter element 101 may comprise a xenon arcflashlamp. An example xenon arc flashlamp may produce, generate, and/oremit beams of light by discharging electricity through ionized xenongas, and the light produced, generated, and/or emitted by the xenon arcflashlamp may comprise infrared light.

While the above description illustrates a xenon arc flashlamp as anexample infrared light source component, it is noted that the scope ofthe present disclosure is not limited to xenon arc flashlamps.Additionally, or alternatively, examples of the present disclosure mayimplement other type(s) of infrared light source component(s) forproducing infrared light.

In some examples, the infrared light may be produced at an intense levelby the infrared light source component of the transmitter element 101.In some examples, the infrared light source component may beelectronically coupled to a power source component, and the power sourcecomponent may supply power to the infrared light source component togenerate discharge energy for triggering infrared light. For example,the example xenon arc flashlamp may produce infrared light that has apulse frequency of 4 Hz, and each pulse of infrared light may have aduration of approximately one microsecond. The pulse frequency,extremely short duration of these pulses of light, and/or the shape ofthe discharge pulses may distinguish the infrared light generated by thexenon arc flashlamp from other natural and artificial sources ofinfrared light in the environment. As a result, the receiver element 103may detect, measure, and/or identify infrared light produced by thexenon arc flashlamp of the transmitter element 101.

While the above description illustrates example pulse frequency andduration of the infrared light generated by an example xenon arcflashlamp, it is noted that the scope of the present disclosure is notlimited to these examples only. For example, examples of the presentdisclosure may include infrared light produced at a pulse frequencyhigher than or lower than 4 Hz. Additionally, or alternatively, examplesof the present disclosure may include infrared light that have aduration of less than or more than one microsecond.

In some examples, the infrared light produced by the infrared lightsource component may be collimated. For example, the transmitter element101 may comprise one or more optical components (such as opticalcollimating lens) to redirect and/or adjust the direction of theinfrared light generated by the infrared light source component. As aresult, parallel beams of infrared light may be emitted from thetransmitter element 101 through the infrared light source component andthe one or more optical components.

Referring now to FIG. 1B and FIG. 1C, a front view and a side view ofthe transmitter element 101 are illustrated, respectively.

In the example shown in FIG. 1C, the transmitter element 101 maycomprise a housing 139, which may provide an enclosure for variouscomponents of the transmitter element 101 (for example, an infraredlight source component and one or more optical components describedabove). In some examples, the transmitter element 101 may comprise aconduit component 123. The conduit component 123 may be connected to thetransmitter element 101, which may provide a protective enclosure forelectrical wire(s) that may connect components within the housing 139(for example, an infrared light source component) with components thatare outside of housing 139 (for example, a power source component).

In the example shown in FIG. 1B, infrared light generated by theinfrared light source component may pass through the window lenscomponent 119. In some examples, the window lens component 119 maycomprise glass and/or other transparent material that may allow theinfrared light to pass through. In some examples, the window lenscomponent 119 may be heated to minimize condensation, frosting and/orbuildup of snow. In some examples, the transmitter element 101 maycomprise an awning component (for example, the awning component 141 asshown in FIG. 1C) that may protect the window lens component 119 fromrain, snow, and/or other particles that may fall on the window lenscomponent 119.

Referring back to FIG. 1A, the transmitter element 101 may be connectedto an mounting bracket 111 through a pivot block 105. As an example, thetransmitter element 101 may be connected to the pivot block 105 througha fastener 125 (such as a bolt and a nut). As an example, the pivotblock 105 may be fastened to the mounting bracket 111 through a fastener127 (such as a bolt and a nut). Prior to the fastener 125 and thefastener 127 being tightened, the transmitter element 101 may rotate toa desired angle, such that the transmitter element 101 may align withthe receiver element 103. For example, prior to the fastener 125 beingtightened, the transmitter element 101 may rotate around a horizontalaxis. Prior to the fastener 127 being tightened, the pivot block 105 mayrotate around a vertical axis, which may in turn cause the transmitterelement 101 to rotate around the vertical axis.

While the above description illustrates example structural connectionsand relationships between the transmitter element 101 and various othercomponents of the example open path gas detecting device, it is notedthat the scope of the present disclosure is not limited to these examplestructural connections and relationships only. Additionally, oralternatively, the transmitter element 101 may be connected and/orfastened to other components of the example open path gas detectingdevice through other means or in other ways.

Referring back to FIG. 1A, the mounting bracket 111 may be fastened tothe mounting plate 109 through one or more fasteners (such as screws),and the mounting plate 109 may be fastened to a secured structure (forexample, a wall) through one or more fasteners (such as screws).

In the example shown in FIG. 1A, a junction box component 121 may besecurely fastened to the mounting plate 109. The junction box component121 may provide a protective enclosure for various components of theopen path gas detecting device (such as a power source component,electric circuits including processing circuitry (such as amicrocontroller), memory circuitry, and/or the like). In some examples,the conduit component 123 may be connected to the transmitter element101 and the junction box component 121, and one or more componentswithin the junction box component 121 may be connected to componentswithin the transmitter element 101 through electrical wire(s) that aredisposed within the conduit component 123, as described above.

In some examples, the receiver element 103 may be configured to detect,measure, and/or identify the intensity level of the infrared light. Theinfrared light generated by the transmitter element 101 may travelthrough an optical path between the transmitter element 101 and thereceiver element 103 (for example, the optical path D as shown in FIG.1A). In some examples, the distance of the optical path D (for example,the distance between the window lens component 129 of the receiverelement and the window lens component 119 of the transmitter element101) may be between 5 meters to 350 meters. In some examples, thedistance of the optical path D may have other values.

Referring now to FIG. 1D and FIG. 1E, a side view and a front view ofthe receiver element 103 are illustrated, respectively.

As described above, gaseous substance along the optical path D mayabsorb at least some of the infrared light transmitted by thetransmitter element 101. The infrared light may travel through thewindow lens component 129 of the receiver element 103, and the receiverelement 103 may comprise at least one detector component to detect,measure, and/or identify the absorption level of the infrared light bythe gaseous substance along the optical path D. Based on the absorptionlevel, the open path gas detecting device may detect, measure, and/oridentify the concentration level of the gaseous substance.

In some examples, the receiver element 103 may comprise a sampledetector component and a reference detector component. In some examples,the receiver element 103 may comprise an optical component that maydivide the infrared light into two or more portions (for example, butnot limited to, a beam splitter component, a selective filter component(for example, a selective bandpass filter).

In some examples, at least a portion of the infrared light may travelthrough a sample filter component and arrive at the sample detectorcomponent. As described above, the gaseous substance to be detected(“target gaseous substance”) may absorb at least some of the infraredlight, and the sample filter component may filter the infrared light atwavelength(s) and/or wavelength range(s) where the target gaseoussubstance may absorb the infrared light. Accordingly, the sampledetector component may detect the intensity level of infrared light atsuch wavelength(s) and/or wavelength range(s) where target gaseoussubstance may absorb the infrared light.

In some examples, at least a portion of the infrared light may travelthrough a reference filter component and arrive at the referencedetector component. The reference filter component may filter theinfrared light at wavelength(s) and/or wavelength range(s) where thetarget gaseous substance may not or may be less likely to absorb theinfrared light. Accordingly, the reference detector component may detectthe intensity level of infrared light at such wavelength(s) and/orwavelength range(s) where target gaseous substance may not or may beless likely to absorb the infrared light.

In some examples, by calculating a difference or ratio value between theintensity level of infrared light detected by the sample detectorcomponent and the intensity level of infrared light detected by thereference detector component, the example open path gas detecting devicemay determine the concentration level of target gaseous substance alongthe optical path D.

In the example shown in FIG. 1D and FIG. 1E, the receiver element 103may comprise a housing 131, which may provide an enclosure for variouscomponents of the receiver element 103 (for example, the sample detectorcomponent, the sample filter component, the reference detectorcomponent, and the reference filter component described above).

In some examples, the receiver element 103 may comprise a conduitcomponent 133. The conduit component 133 may be connected to thereceiver element 103, which may provide a protective enclosure forelectrical wire(s) that may connect components within the housing 131(for example, the sample detector component, the reference detectorcomponent) with components that are outside of housing 131. For example,the sample detector component and the reference detector component maybe connected to various electronic components to amplify, conditionand/or process the signals received by the sample detector component andthe reference detector component. As an example, the sample detectorcomponent and/or the reference detector component may be connected to adigital signal processor (DSP), which may be configured to performsignal processing calculations.

Additionally, or alternatively, a microprocessor may be implemented tocontrol the overall function of the open path gas detecting device. Forexample, the microprocessor may be electronically coupled to thetransmitter element 101 and/or the receiver element 103, and may performthe final calculations to determine reading of the concertation level ofthe target gaseous substance, and may output state of the open path gasdetecting device.

Referring back to FIG. 1D and FIG. 1E, infrared light may travel throughthe window lens component 129 of the receiver element 103. In someexamples, the window lens component 129 may be heated to minimizecondensation, frosting and/or buildup of snow. In some examples, thelevel of heating applied to the window lens component 129 may becontrolled by the microcontroller, and may be adjusted from zero tomaximum depending on the temperature of the window lens component 129.In some examples, the receiver element 103 may comprise an awningcomponent (for example, the awning component 143 as shown in FIG. 1D)that may protect the window lens component 129.

Referring back to FIG. 1A, the receiver element 103 may be connected toan mounting bracket 115 through a pivot block 107. As an example, thereceiver element 103 may be connected to the pivot block 107 through afastener 135 (such as a bolt and a nut). As an example, the pivot block107 may be fastened to the mounting bracket 115 through a fastener 137(such as a bolt and a nut). Prior to the fastener 135 and the fastener137 being tightened, the receiver element 103 may rotate to a desiredangle, such that the receiver element 103 may align with the transmitterelement 101. For example, prior to the fastener 135 being tightened, thereceiver element 103 may rotate around a horizontal axis. Prior to thefastener 137 being tightened, the pivot block 107 may rotate around avertical axis, which may in turn cause the receiver element 103 torotate around the vertical axis.

While the above description illustrates example structural connectionsand relationships between the receiver element 103 and various othercomponents of the example open path gas detecting device, it is notedthat the scope of the present disclosure is not limited to these examplestructural connections and relationships only. Additionally, oralternatively, the receiver element 103 may be connected and/or fastenedto other components of the example open path gas detecting devicethrough other means or in other ways.

Referring back to FIG. 1A, the mounting bracket 115 may be fastened tothe mounting plate 113 through one or more fasteners (such as screws),and the mounting plate 113 may be fastened to a secured structure (forexample, a wall) through one or more fasteners (such as screws).

In the example shown in FIG. 1A, a junction box component 117 may besecurely fastened to the mounting plate 113. The junction box component117 may provide a protective enclosure for various components of theopen path gas detecting device (such as electronic components describeabove). In some examples, the conduit component 133 may be connected tothe receiver element 103 and the junction box component 117, and one ormore components within the junction box component 117 may be connectedto components within the receiver element 103 through electrical wire(s)that are disposed within the conduit component 133, as described above.

While the above description and FIGS. 1A-1E illustrate various examplecomponents of an example open path gas detecting device, it is notedthat the scope of the present disclosure is not limited to these examplecomponents only. In some examples, an example open path gas detectingdevice may comprise less than or more than these example components asillustrated in FIGS. 1A-1E. Additionally, or alternatively, an exampleopen path gas detecting device may comprise other components, includingbut not limited to, aimer, viewfinder, and/or the like.

Referring now to FIG. 2 , an example diagram illustrating variouscomponents of an example transmitter element 200 of an example open pathgas detecting device is shown.

In the example shown in FIG. 2 , the example transmitter element 200 maycomprise an infrared light source component 202, an optical component204, and a window lens component 206.

In some examples, the infrared light source component 202 may bedisposed within the transmitter element 200. For example, the infraredlight source component 202 may be securely positioned on an innersurface of the transmitter element 200.

In some examples, the infrared light source component 202 may beconfigured to produce, generate, and/or emit infrared light. Forexample, the infrared light source component 202 may comprise a xenonarc flashlamp. As described above, the xenon arc flashlamp may produce,generate, and/or emit beams of light by discharging energy throughionized xenon gas, and the light produced, generated, and/or emitted bythe xenon arc flashlamp may comprise infrared light.

In some examples, the xenon arc flashlamp may be connected to a lampdrive component. For example, the lamp drive component may comprise apower source component, which may provide a power source for the xenonarc flashlamp to discharge energy through ionized xenon gas as describedabove. In such an example, the discharge energy level of the xenon arcflashlamp may be associated with the power provided by the power sourcecomponent. For example, the power source component may comprise a 24 VDCpower supply, which may be connected to the xenon arc flashlamp throughelectric wire(s). Additionally, or alternatively, the power sourcecomponent may comprise an adjustable power supply that may providevoltage to power the xenon arc flashlamp at one or more differentlevels. For example, the voltage level of the adjustable power supplymay be controlled by a microcontroller. The higher the voltage levelprovided to the xenon arc flashlamp, the higher the discharge energythat the xenon arc flashlamp may have.

In some examples, when the xenon arc flashlamp is connected to the lampdrive component (for example, a power source component) and powered on,the xenon arc flashlamp may generate an arc 208. The arc 208 mayproduce, generate, and/or emit infrared light beams. In the exampleshown in FIG. 2 , the infrared light beams produced, generated, and/oremitted by the arc 208 may have a beam divergence value A. The term“beam divergence” refers to an angular measurement of an increase in thebeam diameter (or radius) with respect to an increase of distance fromthe beam source (for example, the arc 208) where the beam emerges. Insome examples, the beam divergence value A may be affected by the sizeof the arc 208. A lower discharge energy of the xenon arc flashlamp mayreduce the size of the arc 208, which in turn reduces the field angle(or divergence angle) of the beam after the optical component 204 (forexample, silicon lens), resulting in a reduced angular spread of thebeam. In some examples, the primary effect of reducing discharge energymay be to reduce the size of the arc 208. The smaller arc size mayresult in a more tightly collimated beam from the transmitter after thesilicon lens. However, it is noted that, in some examples, divergencevalue A may not change significantly with discharge energy and the sizeof the arc 208.

In some examples, the size of the arc 208 may be a function of thedischarge energy of the xenon arc flashlamp. For example, the higher thedischarge energy, the larger the size of the arc 208. In some examples,the beam divergence value A may be modulated between two or more valuesby periodically adjusting or changing the discharge energy of the xenonarc flashlamp.

Referring back to FIG. 2 , the optical component 204 may be disposedwithin the transmitter element 200. For example, the edge of the opticalcomponent 204 may be securely attached on an inner surface of thetransmitter element 200. In some examples, the optical axis of theoptical component 204 (for example, the central axis of the opticalcomponent 204) may be aligned with the infrared light source component202. For example, the optical component 204 may be positioned such thatthe optical axis may pass through the center of the arc 208. In someexamples, the optical component 204 may be structurally connected to thetransmitter element 200 in other ways.

In some examples, the optical component 204 may be configured tocollimate the infrared light beams generated by the arc 208. As anexample, the optical component 204 may comprise one or more opticalcollimating lens, such as but not limited to one or more lens havingspherical surface(s), one or more lens having parabolic surface(s)and/or the like. For example, the optical component 204 may comprisesilicon meniscus lens.

In the example shown in FIG. 2 , the infrared light beams generated bythe arc 208 may pass through the optical component 204, and the infraredlight beams may be collimated by the optical component 204 into parallelor approximately parallel rays of infrared light. In some examples, theoptical component 204 may have an effective focal length of seventy-fivemillimeters. In some examples, the optical component 204 may have aneffective focal length of other value(s).

Subsequent to passing through the optical component 204, the infraredlight beams may pass through the window lens component 206 of thetransmitter element 200.

While the above description illustrates example components of atransmitter element 200 of an example open path gas detecting device, itis noted that the scope of the present disclosure is not limited tothese example components only. In some examples, an example transmitterelement may comprise less than or more than those components illustratedin FIG. 2 . For example, a processor circuitry (such as amicrocontroller) may be connected to the infrared light source component202 (or to a power source component that is electronically coupled theinfrared light source component 202) to control the discharge energy ofthe xenon arc flashlamp. Additional details are described furtherherein.

In some examples, at least a portion of the infrared light beams emittedfrom the transmitter element 200 may be absorbed by the gaseoussubstance along the optical path between the transmitter element 200 anda receiver element of the example open path gas detecting device, andthe receiver element may comprise one or more detector components todetect, measure, and/or identify the intensity level of infrared light.

As described above, it may be necessary to determine if the transmitterelement is aligned correctly to the receiver element (i.e. pointingdirectly at the receiver element), such that the open path gas detectingdevice may produce an accurate reading. In some examples, the directionof infrared light emitted by the transmitter element may be accessed orevaluated to determine if the transmitter element is aligned correctlyto the receiver element. For example, the receiver element may generatea measurement corresponding to the intensity level of the infrared lightreceived by the receiver element, and the measurement may be comparedagainst an predetermined value (for example, an expected intensity levelof the infrared light if the transmitter element is aligned correctly tothe receiver element). Based on the measurement equals to orapproximates the predetermined value, it may be determined that thetransmitter element is aligned correctly to the receiver element. Basedon the difference between the measurement and the predetermined valueexceeding the predetermined threshold, it may be determined that thetransmitter element is not aligned correctly to the receiver element.

While the description above provides an example solution to diagnosingmisalignment of the transmitter element, technical challenges exist whenimplementing the example solution. For example, the alignment of thereceiver element may also directly influence the received infrared lightintensity by the receiver element, and it can be technical challengingto differentiate between an alignment error in the transmitter elementand an alignment error of the receiver element. As another example, thereceived infrared light intensity at the receiver element may beaffected by the light transmission through window lens component of thereceiver element and/or the transmitter element and by light absorptionalong the optical path. If the receiver element detects, measures,and/or identifies a lower than expected intensity level of infraredlight, it can be technical challenging to determine whether the lowerthan expected intensity level is caused by an alignment error of thetransmitter element or caused by light absorption due to for example,dirt on the window lens component.

Referring now to FIG. 3 , an example flowchart illustrates an examplemethod 300 in accordance with examples of the present disclosure. Inparticular, the example method 300 may provide technical solutions fordiagnosing misalignment of the transmitter element. In some examples,the example method 300 may overcome the technical challenges discussedabove.

It is noted that each block of the flowchart, and combinations of blocksin the flowchart, may be implemented by various means such as hardware,firmware, circuitry and/or other devices associated with execution ofsoftware including one or more computer program instructions. Forexample, one or more of the procedures described in FIG. 3 may beembodied by computer program instructions, which may be stored by anon-transitory memory of an apparatus employing an example of thepresent disclosure and executed by a processor in the apparatus. Thesecomputer program instructions may direct one or more components of thetransmitter element and/or the receiver element of the open path gasdetecting device to function in a particular manner, such that theinstructions stored in the computer-readable storage memory produce anarticle of manufacture, the execution of which implements the functionspecified in the flowchart block(s).

As will be understood, the processor may be embodied in a number ofdifferent ways. For example, the processor may be embodied as one ormore complex programmable logic devices (CPLDs), microprocessors,multi-core processors, coprocessing entities, application-specificinstruction-set processors (ASIPs), microcontroller and/or controllers.Further, the processor may be embodied as one or more other processingdevices or circuitry. The term circuitry may refer to an entirelyhardware example or a combination of hardware and computer programproducts. Thus, the processor may be embodied as integrated circuits,application specific integrated circuits (ASICs), field programmablegate arrays (FPGAs), programmable logic arrays (PLAs), hardwareaccelerators, other circuitry, and/or the like. As will therefore beunderstood, the processor may be configured for a particular use orconfigured to execute instructions stored in volatile or non-volatilemedia or otherwise accessible to the processor. As such, whetherconfigured by hardware or computer program products, or by a combinationthereof, the processor may be capable of performing steps or operationsaccording to examples of the present disclosure when configuredaccordingly.

As will be understood, the non-transitory memory may include one or morenon-volatile storage or storage media, such as hard disks, ROM, PROM,EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks,CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, and/or the like. Aswill be recognized, the non-transitory memory may store databases,database instances, applications, programs, program modules, scripts,source code, object code, byte code, compiled code, interpreted code,machine code, executable instructions, and/or the like. The termdatabase, database instance, database management system entity, and/orsimilar terms used herein interchangeably and in a general sense torefer to a structured or unstructured collection of information/datathat is stored in a computer-readable storage medium.

As will be understood, examples of the present disclosure may beconfigured as methods, devices, and the like. Accordingly, examples maycomprise various means including entirely of hardware or any combinationof software and hardware. Furthermore, examples may take the form of acomputer program product on at least one non-transitorycomputer-readable storage medium having computer-readable programinstructions (e.g., computer software) embodied in the storage medium.Similarly, examples may take the form of a computer program code storedon at least one non-transitory computer-readable storage medium. Anysuitable computer-readable storage medium may be utilized includingnon-transitory hard disks, CD-ROMs, flash memory, optical storagedevices, or magnetic storage devices.

Referring back to FIG. 3 , the example method 300 may start at block301. At block 303, a processing circuitry (for example, amicrocontroller electronically coupled to a transmitter element and/or areceiver element of an example open path gas detecting device) may causethe infrared light source component to generate first infrared light.

As described above, the infrared light source component may comprise axenon arc flashlamp. The xenon arc flashlamp may produce, generate,and/or emit beams of infrared light by discharging electricity throughionized xenon gas. For example, when the xenon arc flashlamp isconnected to the lamp drive component (for example, a power sourcecomponent) and powered on, the xenon arc flashlamp may generate an arc.

In some examples, the processing circuitry may cause the infrared lightsource component to generate first infrared light triggered at a firstdischarge energy level of the infrared light source component. Forexample, the processing circuitry may cause the power source componentto supply power at a first voltage level (also referred to as a firstvoltage level power) to the xenon arc flashlamp. In some examples, thefirst voltage level may be a baseline voltage level such as 24 VDC. Insome examples, the first voltage level may have other values. The firstvoltage level may provide a first discharge energy level to the xenonarc flashlamp, and the xenon arc flashlamp may generate the firstinfrared light in response to and/or triggered by the first dischargeenergy level.

At block 305, a processing circuitry (for example, a microcontrollerelectronically coupled to a transmitter element and/or a receiverelement of an example open path gas detecting device) may cause the atleast one detector component to generate a first light intensityindication. In some examples, the first light intensity indication maycorrespond to the first infrared light generated by the transmitterelement and triggered at the first discharge energy level.

In some examples, the first light intensity indication may indicate afirst intensity level of the first infrared light received by thereceiver element. As described above, the receiver element may compriseone or more detector components that may detect, measure, and/oridentify the intensity level of the beam of the infrared light. Forexample, the one or more detector components may generate one or moresignals that may indicate the first intensity level of the firstinfrared light received by the receiver element. In some examples, thereceiver element may process the one or more signals through one or moreprocessors (such as a digital signal processor and/or a microprocessoras described above) to generate the first light intensity indicationcorresponding to the first infrared light received by the receiverelement.

Referring now to FIG. 4 and FIG. 5 , example diagrams illustrate exampleirradiance levels of the first infrared light received by the receiverelement. The term “irradiance” refers to a measure of radiant powerreceived by a surface or a plane per unit area. For example, FIG. 4illustrates the irradiance levels of the first infrared light receivedby the receiver element at a horizontal plane of the receiver element.FIG. 5 illustrates the irradiance levels of the first infrared lightreceived by the receiver element at a vertical plane of the receiverelement. In some examples, these example irradiance levels may bedetermined based on the first light intensity indication generated bythe receiver element.

At block 307, a processing circuitry (for example, a microcontrollerelectronically coupled to a transmitter element and/or a receiverelement of an example open path gas detecting device) may cause theinfrared light source component to generate second infrared light.

In some examples, the second infrared light may be triggered at a seconddischarge energy level. In some examples, the second discharge energylevel may be different from the first discharge energy level describedabove in connection with block 303. For example, the processingcircuitry may cause the power source component to supply power at asecond voltage level (also referred to as a second voltage level power)to the xenon arc flashlamp. In some examples, the second voltage levelmay be a reduced voltage level such as 12 VDC. In some examples, thesecond voltage level may have other values. The second voltage level mayprovide a second discharge energy level to the xenon arc flashlamp, andthe xenon arc flashlamp may generate the second infrared light inresponse to and/or triggered by the second discharge energy level.

At block 309, a processing circuitry (for example, a microcontrollerelectronically coupled to a transmitter element and/or a receiverelement of an example open path gas detecting device) may cause the atleast one detector component to generate a second light intensityindication.

In some examples, the second light intensity indication may correspondto the second infrared light generated by the transmitter element at thesecond discharge energy level. For example, the second light intensityindication may indicate a second intensity level of the second infraredlight received by the receiver element

Referring now to FIG. 6 and FIG. 7 , example diagrams illustratingexample irradiance levels of the second infrared light received by thereceiver element. For example, FIG. 6 illustrates the irradiance levelsof the second infrared light received by the receiver element at ahorizontal plane of the receiver element. FIG. 7 illustrates theirradiance levels of the second infrared light received by the receiverelement at a vertical plane of the receiver element. In some examples,these example irradiance levels may be determined based on the secondlight intensity indication generated by the receiver element.

Comparing FIG. 6 and FIG. 4 , the beam divergence value in thehorizontal plane decreases as the discharge energy decreases from thefirst discharge energy level to the second discharge energy level.Comparing FIG. 7 and FIG. 5 , the beam divergence value in the verticalplane also decreases as the discharge energy decreases from the firstdischarge energy level to the second discharge energy level.

In some examples, the processing circuitry may generate an alignmentindication based at least in part on the first light intensityindication and the second light intensity indication. In some examples,the alignment indication may indicate whether the transmitter element ismisaligned to the receiver element.

As described above, the first light intensity indication may indicate afirst intensity level of the first infrared light received by thereceiver element, and the second light intensity indication may indicatea second intensity level of the second infrared light received by thereceiver element. In some examples, the processing circuitry maycalculate a ratio value between first intensity level and the secondintensity level.

As shown at block 311 of FIG. 3 , a processing circuitry (for example, amicrocontroller electronically coupled to a transmitter element and/or areceiver element of an example open path gas detecting device) maydetermine whether the ratio value satisfies a predetermined threshold.

As described above, the ratio value may be affected if the alignment ofthe transmitter element degrades. For example, when the transmitterelement is correctly aligned with the receiver element, an alignmentangle between a central axis of the transmitter element and a centralaxis of the receiver element is zero, and the ratio value may be at apredetermined value or within a predetermined threshold based on thefirst discharge energy and the second discharge energy. As the alignmentof the transmitter element degrades, the alignment angle may increase,result in a change of the ratio value.

In some examples, the predetermined value and/or the predeterminedthreshold may be determined or calculated when the transmitter elementis correctly aligned to the receiver element. For example, during theinitial installation of the transmitter element, the processingcircuitry may determine the predetermined value and/or the predeterminedthreshold. Additionally, or alternatively, the predetermined valueand/or the predetermined threshold may be determined based on, forexample but not limited to, a system requirement that may correspond toa system toleration of the misalignment of the transmitter element.

Based on comparing the ratio value between first intensity level and thesecond intensity level with the predetermined value and/or thepredetermined threshold, examples of the present disclosure may removethe dependency on absolute values to diagnose transmitter elementmisalignment, and may overcome technical challenges discussed above.

Referring back to FIG. 3 , if, at block 311, the processing circuitrydetermines that the ratio value satisfies the predetermined threshold,the processing circuitry may determine that there is no misalignment ofthe transmitter element at block 313.

For example, when the ratio value is a positive value and is less thanthe predetermined threshold, the processing circuitry may determine thatthe ratio value satisfies the predetermined threshold. As anotherexample, when the ratio value is a negative value and is more than thepredetermined threshold, the processing circuitry may determine that theratio value satisfies the predetermined threshold. In some examples, theprocessing circuitry may generate the alignment indication to indicatethat the transmitter element is not misaligned to the receiver element.

If, at block 311, the processing circuitry determines that the ratiovalue does not satisfies the predetermined threshold, the processingcircuitry may determine that there is misalignment of the transmitterelement at block 315.

For example, when the ratio value is a positive value and is more thanthe predetermined threshold, the processing circuitry may determine thatthe ratio value does not satisfy the predetermined threshold. As anotherexample, when the ratio value is a negative value and is less than thepredetermined threshold, the processing circuitry may determine that theratio value does not satisfy the predetermined threshold. In someexamples, the processing circuitry may generate the alignment indicationto indicate that the transmitter element is misaligned to the receiverelement. For example, the processing circuitry may generate a warningsignal that may caution an operator of the open path gas detectingdevice on the misalignment of the transmitter element (for example, anelectronic message rendered for display on a user interface of a deviceassociated with the operator, an alert sound generated by a speakerelement installed in the environment near the operator, and/or thelike).

The example method 300 ends at block 317.

Referring now to FIG. 8 , an example diagram illustrating variouscomponents of an example receiver element 800 of an example open pathgas detecting device is shown.

As described above, the example receiver element 800 may comprisevarious components for detecting, measuring, and/or identifying anintensity level of the infrared light received by the receiver element800. For example, the receiver element 800 may receive infrared lightthat is generated by an example transmitter element of an example openpath gas detecting device, and travelled through the optical path andthe window lens component 802 of the receiver element 800. The infraredlight may be redirected by a mirror component 804 to a detection channel806. In some examples, the detection channel 806 may comprise a sampledetector component 808 and a reference detector component 810.

In some examples, at least a portion of the infrared light may travelthrough a sample filter component 812 and arrive at the sample detectorcomponent 808. As described above, the target gaseous substance mayabsorb infrared light, and the sample filter component 812 may filterthe infrared light at wavelength(s) and/or wavelength range(s) where thetarget gaseous substance may absorb the infrared light. Accordingly, thesample detector component 808 may detect the intensity level of infraredlight at such wavelength(s) and/or wavelength range(s) where targetgaseous substance may absorb the infrared light.

In some examples, at least a portion of the infrared light may travelthrough a reference filter component 814 and arrive at the referencedetector component 810. The reference filter component 814 may filterthe infrared light at wavelength(s) and/or wavelength range(s) where thetarget gaseous substance may not or may be less likely to absorb theinfrared light. Accordingly, the reference detector component 810 maydetect the intensity level of infrared light at such wavelength(s)and/or wavelength range(s) where target gaseous substance may not or maybe less likely to absorb the infrared light.

In some examples, by calculating a difference or ratio value between theintensity level of infrared light detected by the sample detectorcomponent 808 and the intensity level of infrared light detected by thereference detector component 810, the example open path gas detectingdevice may determine the concentration level of target gaseous substancealong the optical path. In some examples, the example receiver element800 may transmit data and/or signal associated with the concentrationlevel of target gaseous substance to a connected control system (forexample, to a processing circuitry such as a microcontroller). In someexamples, the example receiver element 800 may implement functionality,in some examples, for installation, commissioning, and maintenance ofthe open path gas detecting device.

In some examples, the sample filter component 812, the sample detectorcomponent 808, the reference filter component 814, and the referencedetector component 810 may be disposed within the receiver element 800.For example, each of the sample filter component 812, the sampledetector component 808, the reference filter component 814, and thereference detector component 810 may be securely positioned with respectan inner surface of the receiver element 800 through one or moresupporting beams and/or other supporting structure. In some examples,the sample filter component 812, the sample detector component 808, thereference filter component 814, and the reference detector component 810may be positioned in a coaxial arrangement with one another, such that,for example, an optical axis Y of the detection channel 806 may passthrough the center of the sample filter component 812, the center of thesample detector component 808, the center of the reference filtercomponent 814, and the center of the reference detector component 810.

While the above description illustrates some example components of thedetection channel 806, it is noted that the scope of the presentdisclosure is not limited to these example components only. For example,an example detection channel may additionally or alternatively includeother components, and/or various components of the example detectionchannel may be positioned differently than those shown in FIG. 8 .

Similar to those described above in connection with the exampletransmitter element, it may be necessary to determine if the receiverelement is aligned correctly to the transmitter element (i.e. pointingdirectly at the transmitter element), such that the open path gasdetecting device may produce an accurate reading. In some examples, thereceiver element may generate a measurement corresponding to theintensity level of the infrared light received by the receiver element,and the measurement may be compared against an predetermined value (forexample, an expected intensity level of infrared light if the receiverelement is aligned correctly to the transmitter element). Based on themeasurement equals to or approximates the predetermined value, it may bedetermined that the receiver element is aligned correctly to thetransmitter element. Based on the ratio between the measurement and thepredetermined value exceeding the predetermined threshold, it may bedetermined that the receiver element is not aligned correctly to thetransmitter element.

While the description above provides an example solution to diagnosingmisalignment of the receiver element, there are technical challengeswhen implementing the example solution, similar to those described abovein connection with the example transmitter element. For example, thealignment of the transmitter element may also directly influence thereceived infrared light intensity at the receiver element. It can betechnical challenging to differentiate between an alignment error in thetransmitter element and an alignment error of the receiver element. Asanother example, the received infrared light intensity at the receiverelement may be affected by the light transmission through window lenscomponent of the receiver element and/or the transmitter element and bylight absorption along the optical path. If the receiver elementdetects, measures, and/or identifies a lower than expected intensitylevel of infrared light, it can be technical challenging to determinewhether the lower than expected intensity level is caused by analignment error of the receiver element or caused by light absorptiondue to for example, dirt on the window lens component. Additionally, thedesign of the receiver element may be optimized such that the receiverelement may be insensitive to small errors in alignment. In other words,a significant misalignment of the receiver element may need to occurbefore any reduction in the intensity level may be detected by thereceiver element.

Various examples of the present disclosure may provide example technicalsolutions for diagnosing misalignment of the receiver element that mayovercome the technical challenges discussed above. Referring back toFIG. 8 , the example receiver element 800 may comprise a diagnosischannel 816.

In the example shown in FIG. 8 , the diagnosis channel 816 may comprisean optical component 818 and a detector component 820. In some examples,the optical component 818 may comprise a silicon lens, which may directthe infrared light to the detector component 820. In some examples, thedetector component 820 may be configured to generate a light intensityindication that may indicate the intensity level of the receivedinfrared light. For example, a surface of the detector component 820 maycomprise a photodiode active area that may detect, measure, and/oridentify intensity level of the infrared light. In some examples, thephotodiode active area may comprise indium gallium arsenide (InGaAs).

In some examples, the optical component 818 and the detector component820 may be disposed within the receiver element 800. For example, eachof the optical component 818 and the detector component 820 may besecurely positioned with respect an inner surface of the receiverelement 800 through one or more supporting beams and/or other supportingstructure. In some examples, the optical component 818 and the detectorcomponent 820 may be positioned in a coaxial arrangement with oneanother, such that an optical axis X of the diagnosis channel 816 maypass through the center of the optical component 818 and the center ofthe detector component 820.

While the above description illustrates some example components of thediagnosis channel 816, it is noted that the scope of the presentdisclosure is not limited to these example components only. For example,an example diagnosis channel of the present disclosure may additionallyor alternatively include other components, and/or various components ofthe example diagnosis channel may be positioned differently than thoseshown in FIG. 8 .

In some examples, the diagnosis channel 816 may be disposed in aparallel arrangement with the detection channel 806. For example, asshown in FIG. 8 , an optical axis X of the diagnosis channel 816 (whichmay, for example, correspond to the central axis of the opticalcomponent 818 and/or the central axis of detector component 820) may beparallel to an optical axis Y of the detection channel 806 (which may,for example, correspond to the central axis of the sample filtercomponent 812, the central axis of the sample detector component 808,the central axis of the reference filter component 814, and/or thecentral axis of the reference detector component 810).

In some examples, the diagnosis channel 816 may be disposed at an offsetdistance from the detection channel 806. For example, as shown in FIG. 8, the optical axis X of the diagnosis channel 816 may be at a distance Zfrom the optical axis Y of the detection channel 806.

In some examples, an effective field of view of the diagnosis channel816 may be less than an effective field of view of the detection channel806. For example, the size of the photodiode active area of the detectorcomponent 820 of the diagnosis channel 816 may be smaller than the sizeof the photodiode active area of the reference detector component 810 ofthe detection channel 806 and/or the size of the photodiode active areaof the sample detector component 808 of the detection channel 806. As anexample, the photodiode active area of the detector component 820 of thediagnosis channel 816 may have a diameter of 0.3 millimeter, and thephotodiode active area of the reference detector component 810 of thedetection channel 806 and/or the photodiode active area of the sampledetector component 808 of the detection channel 806 may have a diameterof 1.1 millimeters. In some examples, the photodiode active area of thedetector component 820, the photodiode active area of the referencedetector component 810, and/or the photodiode active area of sampledetector component 808 may have other size value(s).

As described above, the diagnosis channel 816 may be arranged parallelto but offset from the detection channel 806, and the diagnosis channel816 may have an effective field of view smaller than the effective fieldof view of the detection channel 806. As such, the intensity level ofinfrared light detected by the diagnosis channel 816 may be differentfrom the intensity level of infrared light detected by the detectionchannel 806.

In some examples, the ratio between the intensity level of infraredlight detected on the diagnosis channel 816 and the intensity level ofinfrared light detected on the detection channel 806 may be affected bythe degree of misalignment of the receiver element 800. For example, thehigher the degree of the misalignment of the receiver element 800, thehigher the ratio between the intensity level of infrared light detectedon the diagnosis channel 816 and the intensity level of infrared lightdetected on the detection channel 806. In some examples, by comparingthe ratio with a predetermined value or a predetermined threshold,misalignment of the receiver element 800 may be detected.

Referring now to FIG. 9 , an example flowchart illustrates an examplemethod 900 in accordance with examples of the present disclosure. Inparticular, the example method 900 may provide technical solutions fordiagnosing misalignment of the receiver element. In some examples, theexample method 900 may overcome the technical challenges discussedabove.

Similar to those described above in connection with FIG. 3 , each blockof the flowchart, and combinations of blocks in the flowchart, may beimplemented by various means such as hardware, firmware, circuitryand/or other devices associated with execution of software including oneor more computer program instructions. Accordingly, examples of thepresent disclosure may be configured as methods, devices, and the like,and may comprise various means including entirely of hardware or anycombination of software and hardware. Furthermore, examples may take theform of a computer program product on at least one non-transitorycomputer-readable storage medium having computer-readable programinstructions (e.g., computer software) embodied in the storage medium.

Referring back to FIG. 9 , the example method 900 may start at block901.

At block 903, a processing circuitry (for example, a microcontrollerelectronically coupled to a receiver element of an example open path gasdetecting device) may cause a detection channel to generate a firstlight intensity indication.

As described above in connection with FIG. 8 , an example receiverelement may comprise a detection channel and a diagnosis channel. Insome examples, each of the detection channel and the diagnosis channelmay be configured to generate a light intensity indication correspondingto infrared light received by the receiver element. For example, thedetection channel may comprise a sample detector component and/or areference detector component, which may be configured to generate alight intensity indication indicating an intensity level of the infraredlight received through the detection channel.

At block 905, a processing circuitry (for example, a microcontrollerelectronically coupled to a receiver element of an example open path gasdetecting device) may cause the diagnosis channel to generate a secondlight intensity indication.

As described above in connection with FIG. 8 , the diagnosis channel maycomprise a detector component, which may be configured to generate alight intensity indication indicating an intensity level of the infraredlight received through the diagnosis channel.

At block 907, a processing circuitry (for example, a microcontrollerelectronically coupled to a receiver element of an example open path gasdetecting device) may determine whether the ratio value between thefirst light intensity indication and the second light intensityindication satisfies a predetermined value and/or a predeterminedthreshold.

In some examples, the predetermined value and/or the predeterminedthreshold may be determined or calculated when the receiver element iscorrectly aligned to the transmitter element. For example, during theinitial installation of the receiver element, the processing circuitrymay determine the predetermined value and/or the predeterminedthreshold. Additionally, or alternatively, the predetermined valueand/or the predetermined threshold may be determined based on, forexample but not limited to, a system requirement that may corresponds toa system toleration of the misalignment of the receiver element.

If, at block 907, the processing circuitry determines that the ratiovalue satisfies the predetermined threshold, the processing circuitrymay determine that there is no misalignment of the receiver element atblock 909.

For example, when the ratio value is a positive value and is less thanthe predetermined threshold, the processing circuitry may determine thatthe ratio value satisfies the predetermined threshold. As anotherexample, when the ratio value is a negative value and is more than thepredetermined threshold, the processing circuitry may determine that theratio value satisfies the predetermined threshold. In some examples, theprocessing circuitry may generate the alignment indication to indicatethat the receiver element is not misaligned to the transmitter element.

If, at block 907, the processing circuitry determines that the ratiovalue does not satisfies the predetermined threshold, the processingcircuitry may determine that there is misalignment of the transmitterelement at block 911.

For example, when the ratio value is a positive value and is more thanthe predetermined threshold, the processing circuitry may determine thatthe ratio value does not satisfy the predetermined threshold. As anotherexample, when the ratio value is a negative value and is less than thepredetermined threshold, the processing circuitry may determine that theratio value does not satisfy the predetermined threshold. In someexamples, the processing circuitry may generate the alignment indicationto indicate that the receiver element is misaligned to the transmitterelement. For example, the processing circuitry may generate a warningsignal that may caution an operator of the open path gas detectingdevice on the misalignment of the receiver element (for example, anelectronic message rendered for display on a user interface of a deviceassociated with the operator, an alert sound generated by a speakerelement installed in the environment near the operator, and/or thelike).

The example method 900 may end at block 913.

As described above, various examples of the present disclosure maygenerate one or more alignment indications that may indicate whether thetransmitter element or the receiver element is correctly aligned. Suchalignment indications may be generated by a microcontroller inaccordance with examples of the present disclosure, which may facilitatean improvement in diagnostic capability, enable each misalignmentcondition to be differentiated, and direct the operator to takeappropriate action.

For example, the microcontroller may generate an alignment indicationthat may indicate the transmitter element is misaligned based on, forexample, those described above in connection with FIG. 2 to FIG. 7 . Asan example, the microcontroller may calculate a ratio value between thefirst light intensity indication (derived from the first dischargeenergy level) and the second light intensity indication (derived fromthe second discharge energy level). Based on determining that the ratiovalue exceeds a predetermined threshold, the microcontroller maygenerate an alignment indication indicating that the transmitter elementis misaligned.

As another example, the microcontroller may generate an alignmentindication that may indicate the receiver element is misaligned basedon, for example, those described above in connection with FIG. 8 to FIG.9 . As an example, the microcontroller may calculate a ratio valuebetween the first light intensity indication (derived from the detectionchannel) and the second light intensity indication (derived from thediagnosis channel). Based on determining that the ratio value exceeds apredetermined threshold, the microcontroller may generate an alignmentindication indicating that the receiver element is misaligned.

While the description above illustrates example indications that may begenerated in accordance with examples of the present disclosure, it isnoted that the scope of the present disclosure is not limited to theseexamples only. In some examples, other indications may be additionallyor alternatively generated.

For example, the microcontroller may generate an indication that mayindicate whether there is obstruction of infrared light along theoptical path. As described above in connection with FIG. 8 , theeffective field of view of the diagnosis channel may be smaller than theeffective field of view of the detection channel, and the diagnosischannel may be in a parallel arrangement but offset from the detectionchannel. In some examples, the detection channel may detect a reductionin intensity level of infrared light, while the diagnosis channel maydetect a disproportional change in the intensity level of infrared light(for example, the intensity level of infrared light may have a minimalchange or a complete loss), the microcontroller may determine that thereis at least partial obscuration of infrared light along the optical path(for example, an object moving along the optical path and blocking theinfrared light, buildup of dust or dirt on window lens components).Accordingly, the microcontroller may generate an indication indicatingthat there is obstruction of infrared light along the optical path.

It is to be understood that the disclosure is not to be limited to thespecific examples disclosed, and that modifications and other examplesare intended to be included within the scope of the appended claims.Although specific terms are employed herein, they are used in a genericand descriptive sense only and not for purposes of limitation, unlessdescribed otherwise.

The invention claimed is:
 1. A gas detecting device, comprising: atransmitter element comprising an infrared light source component; areceiver element comprising at least one detector component; and amicrocontroller electronically coupled to the transmitter element andthe receiver element and configured to: cause the infrared light sourcecomponent to generate a first infrared light triggered at a firstdischarge energy level and a second infrared light triggered at a seconddischarge energy level, cause the at least one detector component togenerate a first light intensity indication corresponding to the firstinfrared light and a second light intensity indication corresponding tothe second infrared light, and generate an alignment indication based atleast in part on the first light intensity indication and the secondlight intensity indication, wherein the alignment indication indicateswhether the transmitter element is misaligned.
 2. The gas detectingdevice of claim 1, wherein the transmitter element comprises a powersource component electronically coupled to the infrared light sourcecomponent, wherein, when causing the infrared light source component togenerate the first infrared light, the microcontroller is configured to:cause the power source component to supply a first voltage level powerto the infrared light source component.
 3. The gas detecting device ofclaim 2, wherein, when causing the infrared light source component togenerate the second infrared light triggered, the microcontroller isconfigured to: cause the power source component to supply a secondvoltage level power to the infrared light source component.
 4. The gasdetecting device of claim 1, wherein the first light intensityindication indicates a first intensity level of the first infrared lightreceived by the receiver element, wherein the second light intensityindication indicates a second intensity level of the second infraredlight received by the receiver element.
 5. The gas detecting device ofclaim 1, wherein the microcontroller is further configured to: calculatea ratio value based on the first light intensity indication and thesecond light intensity indication; and determine whether the ratio valuesatisfies a predetermined threshold.
 6. The gas detecting device ofclaim 5, wherein the microcontroller is further configured to: inresponse to determining that the ratio value satisfies the predeterminedthreshold, generate the alignment indication to indicate that thetransmitter element is not misaligned to the receiver element.
 7. Thegas detecting device of claim 5, wherein the microcontroller is furtherconfigured to: in response to determining that the ratio value does notsatisfy the predetermined threshold, generate the alignment indicationto indicate that the transmitter element is misaligned to the receiverelement.
 8. A method for diagnosing misalignment of a transmitterelement of an open path gas detecting device, the method comprising:causing at least one detector component of a receiver element of theopen path gas detecting device to generate a first light intensityindication corresponding to first infrared light; causing the at leastone detector component to generate a second light intensity indicationcorresponding to second infrared light; and generating an alignmentindication based at least in part on the first light intensityindication and the second light intensity indication.
 9. The method ofclaim 8, further comprising: causing an infrared light source componentof the transmitter element to generate the first infrared lighttriggered at a first discharge energy level; and causing the infraredlight source component to generate the second infrared light triggeredat a second discharge energy level.
 10. The method of claim 9, whereinthe transmitter element comprises a power source componentelectronically coupled to the infrared light source component, wherein,when causing the infrared light source component to generate the firstinfrared light, the method further comprises: causing the power sourcecomponent to supply a first voltage level power to the infrared lightsource component.
 11. The method of claim 10, wherein, when causing theinfrared light source component to generate the second infrared light,the method further comprises: causing the power source component tosupply a second voltage level power to the infrared light sourcecomponent.
 12. The method of claim 8, wherein the first light intensityindication indicates a first intensity level of the first infrared lightreceived by the receiver element, wherein the second light intensityindication indicates a second intensity level of the second infraredlight received by the receiver element.
 13. The method of claim 8,further comprising: calculating a ratio value based on the first lightintensity indication and the second light intensity indication; anddetermining whether the ratio value satisfies a predetermined threshold.14. The method of claim 13, further comprising: in response todetermining that the ratio value satisfies the predetermined threshold,generating the alignment indication to indicate that the transmitterelement is not misaligned to the receiver element.
 15. The method ofclaim 13, further comprising: in response to determining that the ratiovalue does not satisfy the predetermined threshold, generating thealignment indication to indicate that the transmitter element ismisaligned to the receiver element.